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Mold-Tek Packaging board to nod bonus issue
21 Aug 2026, 11:57AM

Mold-Tek Packaging board meeting will be held on August 26, 2026, to consider the proposal of issuance of fully paid bonus equity shares to the Existing Equity shareholders of the Company and recommendation of final dividend, if any, for the financial year ended on March 31, 2026.

Fixation of the Cut-off/Record date for the purpose of sending notice and payment of Final dividend for the Financial Year 2025-26, if declared, at the 42nd AGM and e-voting for the said AGM.

At 11.52 am, Mold-Tek Packaging was trading at Rs. 192.90, up by 2.06%, with a volume of 3618 shares on the BSE.

 

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